Socionext Highlights Advanced Server, Storage, and Networking Technologies at Annual DesignCon
Featuring High Performance SoC, Ultra-High-Speed CMOS Transceivers with 112G+ SerDes, Multi-Die Packaging, and extended HBM+ Sunnyvale, Calif., January 18, 2018 --- Socionext Inc., a leader in state-of-the art system-on-chip technology, will feature its high performance SoC designs, serial transceiver technologies and advanced packaging solutions at the annual DesignCon conference, Jan. 31 – Feb. 1 at the Santa Clara Convention Center, Booth 1239.
At DesignCon, Socionext will showcase ultra energy-efficient 56Gb/s PAM4 SR to LR CMOS transceivers and demonstrate solutions that are optimized to help companies cost-effectively meet today’s performance, functionality and time-to-market package design requirements.
As Cloud Service Providers adopt 56Gb/s serial connectivity to accommodate the rapid growth of traffic in their data centers, they require 56+Gb/s signaling for chip-to-module, chip-to-chip, and board-to-board communications. Socionext offers proven energy-saving SerDes transceivers operating from 1 to 56Gb/s, with 112+ Gb/s solutions available later in 2018.
Socionext’s roadmap further extends these capabilities by utilizing its ultra-high speed ADC & DAC technologies, a key component in coherent and direct detect optical networking SoCs enabling Terabit (Tbps) datacenter interconnect (DCI) solutions for hyperscale cloud operators.
Furthermore, with the adoption of Artificial Intelligence applications within the cloud data center, there is an increasing demand for greater interconnect bandwidth, larger on-chip memory, and ultra-low latency. Socionext is a leading provider of extended HBM+, multi-die packaging, and advanced process node solutions for meeting and exceeding these emerging requirements. As a proven and reliable partner, Socionext quickly delivers high-quality designs that use advanced packaging, high-performance, multi-die SoCs.
Socionext will be raffling great prizes at DesignCon, so stop by booth#1239 to learn more!
For the DesignCon website and programs, visit http://www.designcon.com/
About Socionext
Socionext is a new, innovative enterprise that designs, develops and delivers System-on-Chip products to customers worldwide. The company is focused on imaging, networking, computing and other dynamic technologies that drive today’s leading-edge applications. Socionext combines world-class expertise, experience, and an extensive IP portfolio to provide exceptional solutions and ensure a better quality of experience for customers. Founded in 2015, Socionext Inc. is headquartered in Yokohama, and has offices in Japan, Asia, United States and Europe to lead its product development and sales activities. For more information, visit socionext.com.
For product information, visit the company's website at http:// socionextus.com, e-mail sna_inquiry@us.socionext.com or call 1-844-680-3453. For company news and updates, connect with us on Twitter (https://www.twitter.com/socionextus) and Facebook (https://www.facebook.com/socionextus)
Press Contacts
Sherry Chen
Socionext America Inc.
1-408-737-5654
sna_pr@us.socionext.com
Dick Davies
IPRA
1-415-652-7515
ipra@mindspring.com
All company or product names mentioned herein are trademarks or registered trademarks of their respective owners. Information provided in this press release is accurate at time of publication and is subject to change without advance notice.
Featuring High Performance SoC, Ultra-High-Speed CMOS Transceivers with 112G+ SerDes, Multi-Die Packaging, and extended HBM+ Sunnyvale, Calif., January 18, 2018 --- Socionext Inc., a leader in state-of-the art system-on-chip technology, will feature its high performance SoC designs, serial transceiver technologies and advanced packaging solutions at the annual DesignCon conference, Jan. 31 – Feb. 1 at the Santa Clara Convention Center, Booth 1239.
At DesignCon, Socionext will showcase ultra energy-efficient 56Gb/s PAM4 SR to LR CMOS transceivers and demonstrate solutions that are optimized to help companies cost-effectively meet today’s performance, functionality and time-to-market package design requirements.
As Cloud Service Providers adopt 56Gb/s serial connectivity to accommodate the rapid growth of traffic in their data centers, they require 56+Gb/s signaling for chip-to-module, chip-to-chip, and board-to-board communications. Socionext offers proven energy-saving SerDes transceivers operating from 1 to 56Gb/s, with 112+ Gb/s solutions available later in 2018.
Socionext’s roadmap further extends these capabilities by utilizing its ultra-high speed ADC & DAC technologies, a key component in coherent and direct detect optical networking SoCs enabling Terabit (Tbps) datacenter interconnect (DCI) solutions for hyperscale cloud operators.
Furthermore, with the adoption of Artificial Intelligence applications within the cloud data center, there is an increasing demand for greater interconnect bandwidth, larger on-chip memory, and ultra-low latency. Socionext is a leading provider of extended HBM+, multi-die packaging, and advanced process node solutions for meeting and exceeding these emerging requirements. As a proven and reliable partner, Socionext quickly delivers high-quality designs that use advanced packaging, high-performance, multi-die SoCs.
Socionext will be raffling great prizes at DesignCon, so stop by booth#1239 to learn more!
For the DesignCon website and programs, visit http://www.designcon.com/
About Socionext
Socionext is a new, innovative enterprise that designs, develops and delivers System-on-Chip products to customers worldwide. The company is focused on imaging, networking, computing and other dynamic technologies that drive today’s leading-edge applications. Socionext combines world-class expertise, experience, and an extensive IP portfolio to provide exceptional solutions and ensure a better quality of experience for customers. Founded in 2015, Socionext Inc. is headquartered in Yokohama, and has offices in Japan, Asia, United States and Europe to lead its product development and sales activities. For more information, visit socionext.com.
For product information, visit the company's website at http:// socionextus.com, e-mail sna_inquiry@us.socionext.com or call 1-844-680-3453. For company news and updates, connect with us on Twitter (https://www.twitter.com/socionextus) and Facebook (https://www.facebook.com/socionextus)
Press Contacts
Sherry Chen
Socionext America Inc.
1-408-737-5654
sna_pr@us.socionext.com
Dick Davies
IPRA
1-415-652-7515
ipra@mindspring.com
