Utilizing advanced simulation technologies, we offer the best package solution.
Electrical characteristic Simulation
The most appropriate board pattern can be designed based on the results of electrical characteristic simulation.
[Case: Electrical Characteristic Simulation of Package Board Wiring]
Mechanism Simulation
Incorporating mechanism simulation into package design allows customers to propose high reliability packages.
[Case: Stress Analysis of Solder Joint Sections]
Thermal design Simulation
By combining actual measurement of thermal resistors and thermofluid simulation, we perform high accuracy thermal resistance analysis reproducing the operating environment of products. Analysis in an environment defined by the JEDEC standard is also possible.
